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Curtiss-Wright Controls Embedded Computing

Curtiss-Wright Controls is the industry's most comprehensive and experienced single source for embedded solutions, ranging from Processing, Subsystems, Data Communication, DSP, and Video & Graphics to the most advanced board level components and fully integrated custom systems. The Embedded Computing group serves the defense, aerospace, commercial and industrial markets and is part of Curtiss-Wright Controls Inc.

Our embedded computing solutions provide the most innovative and complete product integration services for high density data processing requirements while performing under the most rugged operating conditions. Our product expertise includes state-of-the-art radar and graphics solutions, high-speed communication, custom software design and hardware engineering, and manufacturing services. From board level products to fully integrated subsystems, we provide advanced technologies to the aerospace, defense and commercial markets.

CWCEC offers a broad range of products founded on open systems architecture 6U VME and 3U/6U CompactPCI. With board-level products, enclosures, software and systems integration services CWCEC can offer an embedded computing solution that meets the requirements of any development or production program. Every CWCEC product is engineered from the onset to perform reliably when subjected to the extreme environments found in military applications.

Our product line is comprised of:

  • High-performance PowerPC™ and Intel™ SBCs
  • Digital signal processing engines
  • Reconfigurable computing and programmable I/O
  • StarFabric switched interconnect technology
  • 3D Graphics and Imaging
  • Radar display systems
  • PMC expansion via PCI and StarFabric hosts
  • Networking technologies including Serial FPDP, Ethernet, Fibre channel, 1553 and StarFabric
  • I/O interfaces including EIA-232/422/485 serial, CANbus, USB and SCSI
  • Support for all the leading real-time operating systems
  • Safety certifiable firmware and board support packages
  • Extensive software drivers and communications libraries
  • Development enclosures
  • Deployable rugged enclosures for air-cooled and conduction-cooled applications

 

   
 

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